Today, AMD has officially unveiled several pieces of good news particularly about the latest CPUs and chipset so if you’re using them, be sure to get things up to speed.
First, the new AGESA PI 1.2.0.2 BIOS dedicated to AMD 600 and X870 motherboards is finally widely available as many board partners have pushed their own firmware updates to their respective offerings. One of the key elements of the update include improved Core-to-Core latency for Ryzen 9 9000-series desktop CPUs as well as expanded warranty coverage for higher power levels on AMD Ryzen 9600X and 9700X processors.
Specifically about the warranty coverage, previously it is dedicated to the Ryzen 7 9700X and Ryzen 5 9600X running at the efficient 65W TDP yet most reviewers and probably AMD themselves agreed that the 105W TDP is where it was supposed to be so now, that new TDP is warranty-backed with no voidings. But still, be sure to keep temperatures in check with adequate cooling.
The 1.2.0.2 BIOS update addresses reported increases in core-to-core latency between Ryzen 7000 and 9000 series multi-CCD models. By optimizing data transactions between cores, the update reduces latency in multi-CCD models. This improvement is most noticeable in heavily threaded games that don’t trigger core parking, such as Metro, Starfield, and Borderlands 3.
For those who want the latest and greatest, the X870 platform consisting of the X870+X870E motherboards is now getting pushed into the market as we speak. Featuring full-speed PCIe 5.0 slot and NVMe slots for maximum bandwidth in 2024 as well as onboard USB4 for high-speed communication and data transfer, the X870 tackles everything from overclocking to daily usage.
As a last note, AMD EXPO is now supporting DDR5-8000 profiles from the previous DDR5-6000 which is pretty good in general to elevate system performance with a couple of simple clicks.
